Anisotropic interpolation method of silicon carbide oxidation growth rates for three-dimensional simulation

نویسندگان

  • Vito Šimonka
  • Georg Nawratil
  • Andreas Hössinger
  • Josef Weinbub
  • Siegfried Selberherr
  • Viktor Sverdlov
چکیده

We investigate anisotropical and geometrical aspects of hexagonal structures of Silicon Carbide and propose a direction dependent interpolation method for oxidation growth rates. We compute threedimensional oxidation rates and perform one-, two-, and three-dimensional simulations for 4Hand 6H-Silicon Carbide thermal oxidation. The rates of oxidation are computed according to the four known growth rate values for the Sið0001Þ, að11 20Þ, mð1 100Þ, and C-face ð000 1Þ. The simulations are based on the proposed interpolation method together with available thermal oxidation models. We additionally analyze the temperature dependence of Silicon Carbide oxidation rates for different crystal faces using Arrhenius plots. The proposed interpolation method is an essential step towards highly accurate three-dimensional oxide growth simulations which help to better understand the anisotropic nature and oxidation mechanism of Silicon Carbide. 2016 Elsevier Ltd. All rights reserved.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

ReaxFF Reactive Molecular Dynamics Study of Orientation Dependence of Initial Silicon Carbide Oxidation.

We analyze the early stage of the highly anisotropic silicon carbide oxidation behavior with reactive force field molecular dynamics simulations. The oxidation of a-, C,- m-, and Si-crystallographic faces is studied at typical industry-focused temperatures in the range from 900 to 1200 °C based on the time evolution of the oxidation mechanism. The oxide thicknesses and the growth rates are obta...

متن کامل

Level Set Approach to Anisotropic Wet Etching of Silicon

In this paper a methodology for the three dimensional (3D) modeling and simulation of the profile evolution during anisotropic wet etching of silicon based on the level set method is presented. Etching rate anisotropy in silicon is modeled taking into account full silicon symmetry properties, by means of the interpolation technique using experimentally obtained values for the etching rates alon...

متن کامل

Geometrical Aspects of Three-Dimensional Silicon Carbide Oxidation Growth Rate Modeling

128 978-3-901578-29-8 Geometrical Aspects of Three-Dimensional Silicon Carbide Oxidation Growth Rate Modeling Vito Šimonka, Georg Nawratil, Andreas Hössinger, Josef Weinbub, Siegfried Selberherr Christian Doppler Laboratory for High Performance TCAD at the Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Wien, Austria Institute of Discrete Mathematics and Geometry, TU Wie...

متن کامل

Anisotropic Laplace Refinement for Three-Dimensional Oxidation Simulation

We present a computational method for three-dimensional tetrahedral mesh refinement according to the demands of oxidation simulation. The main focus lies on two major problems. First, the start-up condition of oxidation claims an initial mesh preparation which is done by the so called Laplace refinement, second the transient conversion of silicon (Si) to silicon dioxide (SiO2) forces a high spa...

متن کامل

A molecular dynamics simulation of water transport through C and SiC nanotubes: Application for desalination

In this work the conduction of ion-water solution through two discrete bundles of armchair carbon and silicon carbide nanotubes, as useful membranes for water desalination, is studied. In order that studies on different types of nanotubes be comparable, the chiral vectors of C and Si-C nanotubes are selected as (7,7) and (5,5), respectively, so that    a similar volume of fluid is investigated ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2016